Technical Program Committee

Marcus Barkowsky, University of Nantes, France
Vittorio Baroncini, Fondazione Ugo Bordoni, Italy
Søren Bech, Bang & Olufsen, Denmark
Sergio Beker, Huawei Technologies, Germany
Fernando Boronat, Universitat Politecnica de Valencia, Spain
Kjell Brunnström, Acreo, Sweden
Shelley Buchinger, University of Vienna, Austria
Ian Burnett, RMIT University, Australia
Jorge Caviedes, Intel, USA
Pablo Cesar, CWI, The Netherlands
Damon Chandler, Oklahoma State University, USA
Kuan-Ta Chen, Academia Sinica, Taiwan
Irene Cheng, University of Alberta, Canada
Lai-Tee Cheok, Singapore Management University, Singapore
Ngai-Man Cheung, Singapore University of Technology and Design, Singapore
Philip Corriveau, Intel, USA
Katrien De Moor, Norwegian University of Science and Technology, Norway
Varuna De Silva, Apical, United Kingdom
Francesca De Simone, Telecom ParisTech, France
Frederic Dufaux, Telecom Paristech, France
Ragnhild Eg, Simula Research Laboratory, Norway
Sebastian Egger, Austrian Institute of Technology, Austria
Khaled El-Maleh, Qualcomm, USA
Ulrich Engelke, Commonwealth Scientific and Industrial Research Organisation (CSIRO), Australia
Tiago Falk, INRS-EMT, Canada
Yuming Fang, Jiangxi University of Finance and Economics, P.R. China
Mylene Farias, University of Brasilia, Brazil
Reuben Farrugia, University of Malta, Malta
Karel Fliegel, Czech Technical University in Prague, Czech Republic
Marie-Neige Garcia, Technische Universität Berlin, Germany
Hans Gierlich, HEAD acoustics, Germany
Frédéric Guyard, Orange Labs, France
Yuukou Horita, University of Toyama, Japan
Tobias Hoßfeld, University of Würzburg, Germany
Quan Huynh-Thu, Canon, Australia
Lucjan Janowski, AGH University of Science and Technology, Poland
Lina Karam, Arizona State University, USA
W. Bastiaan Kleijn, Victoria University of Wellington, New Zealand
Jari Korhonen, Technical University of Denmark, Denmark
Pavel Korshunov, EPFL, Switzerland
Harilaos Koumaras, NCSR Demokritos, Greece
Dragan Kukolj, University of Novi Sad, Serbia
Chaker Larabi, Université de Poitiers, France
Patrick Le Callet, IRCCyN, France
Olivier Le Meur, University of Rennes 1, France
Chulhee Lee, Yonsei University, Korea
Mikolaj Leszczuk, AGH University of Science and Technology, Poland
Hantao Liu, University of Hull, United Kingdom
Maria Martini, Kingston University, United Kingdom
Dongbo Min, Advanced Digital Sciences Center, Singapore
Anish Mittal, Nokia Research, USA
Sebastian Möller, Technische Universität Berlin, Germany
Anush Moorthy, Qualcomm, USA
King Ngan, Chinese University of Hong Kong, P.R. China
Fernando Pereira, IST-IT, Portugal
Andrew Perkis, Norwegian University of Science and Technology, Norway
Matthieu Perreira-Da-Silva, IRCCyN, France
Antonio Pinheiro, University of Beira Interior, Portugal
Margareth, Pinson, NTIA, USA
Judith Redi, Delft University of Technology, The Netherlands
Amy Reibman, AT&T Labs, USA
Ulrich Reiter, Norwegian University of Science and Technology, Norway
Thomas Richter, University of Stuttgart, Germany
Christian Ritz, University of Wollongong, Australia
Raimund Schatz, FTW Telecommunications Research Center Vienna, Austria
Peter Schelkens, Vrije Universiteit Brussel, Belgium
Kalpana Seshadrinathan, Intel, USA
Lea Skorin-Kapov, University of Zagreb, Croatia
Nicolas Staelens, Ghent University – IBBT, Belgium
Eckehard Steinbach, Munich University of Technology, Germany
Hans Stokking, TNO, The Netherlands
Nitin Suresh, Apple, USA
Christian Timmerer, Alpen-Adria-Universität Klagenfurt, Austria
Martin Varela, VTT Technical Research Centre of Finland, Finland
Wieslaw Woszczyk, McGill University, Canada
Junyong You, Christian Michelsen Research, Norway
Guangtao Zhai, Shanghai Jiao Tong University, P.R. China